Tin Lead Solder Paste
· Good fluidity, excellent solderability can be attained at small pattern of 0.3mm pitch bonding pad
· Stable printability with little change in viscosity when printing continuously
· Long Stencil Life - 12 Hours with continuous and consistently printing
· Remain in the same size, shape and position without slumping after several hours of printing
· Good solderbility, adequate wettability is shown on various parts
· Adapted to soldering equipments with different grades; Soldering without nitrogen is available; The soderability is still good in a comparatively wide reflow temperature range, both RSS and RTS temperature setting method are available
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Tin Lead Solder Paste
Applications
PCB assembly, including smartphone, Tablet PC, motherboards, consumer electronics, web server, Automobile electrical system, and equipments of medical, military or aerospace etc.
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