· Low cost

· High reliability: only 0.3% Ag in the alloy, but its joint strength performs better than SAC 305

· Low voiding

· Excellent solderability: solve the poor solder wetting problems of some important Pb-free components, eg. CSP, QFN etc.; Good solderability on various lead-free board / component finishes, including OSP, HASL, ENIG

· Outstanding printability: long stencil life - 12 hours with continuous and consistently printing

· Print speeds of up to 150mm/s , enabling a fast print cycle time and a high throughput

· Wide reflow profile window: reflowable in air or nitrogen, enables high quality solderability of complicated, high density PWB assemblies

· Excellent solder and flux cosmetics after reflow soldering