· High reliability, low voidage

· Strong weldability: It can meet the difficult needs of some important lead-free devices, such as CSP, QFN, etc. Suitable for all kinds of lead-free circuit board surface coating, including: OSP, HASL, ENIG

· Excellent printability and printing life: stable and consistent printing performance of more than 12 hours, printing speed up to 150mm/s, short printing cycle, high output

· Wide reflux temperature curve process window: In air and nitrogen environments, good welding results can be achieved for complex high-density PWB components

· Excellent appearance of solder joints and residues after reflow soldering